High-Speed Pluggable IO

Today’s networking and data center professionals face rapidly escalating bandwidth requirements, demanding high-density interconnects that allow today’s streamlined form factors to support tomorrow’s capabilities. Molex empowers customers with scalable high-speed pluggable input-output (I/O) solutions that help address next-generation thermal and performance needs for future-proof configurations.

Category : Accessories
Brand : Molex
Model : High-Speed Pluggable IO

Description

Industry Standard Pluggable IO

QSFP-DD Connector System

  • QSFP-DD Interconnect System’s 8-lane electrical interface transmits 28G NRZ, 56G PAM-4 and 112G PAM-4, up to 200, 400 or 800 Gbps aggregate. Backwards compatible with QSFP.

QSFP Connector System

  • 28G NRZ, 56G PAM-4, 112G PAM-4, up to 100, 200 or 400Gbps aggregate. Offer low insertion loss and cross talk plus excellent electromagnetic interference (EMI) containment.

OSFP Connector System

  • Octal Small Form Factor Pluggable (OSFP) 112 Gbps PAM-4 Interconnect System and Cable Assemblies provide single-port, 8-lane I/O connectivity with DAC, AOC, ACC and optical modules for high-density switch applications.

SFP and SFP+ Connector System

  • Supporting 2.5 to 10 Gbps data rates for Gigabit Ethernet and Fibre Channel applications, Molex’s SFP+ and SFP products ensure industry-wide compatibility.

SFP-DD (56G PAM-4) Connector System

  • SFP-DD Module and Cage/Connector System delivers a 2-lane electrical interface, complementing QSFP-DD top-of-the-rack interfaces, and addresses issues caused by underpopulated lanes in file server interconnects. Transmits 28G NRZ and 56G PAM-4, up to 50 or 100 Gbps aggregate. Backwards compatible with SFP.

CDFP / zCD Connector System

  • Offering the highest port and bandwidth density of any pluggable form factor available, the zCD Interconnect System delivers 400 Gbps per port with superior signal integrity performance. 16G NRZ, 32G NRZ, 64G PAM-4 for PCIe Gen 3, Gen 4 and Gen 5 applications.

External Laser Source Interconnect System (ELSIS)

  • The External Laser Source Interconnect System (ELSIS) is a first-to-market blind-mating optical and electrical interconnect in a pluggable module format that supports co-packaged optics (CPO) requiring a remote laser source.
Internal Cables

BiPass I/O Connector System

  • BiPass I/O High-Speed Solutions with low-insertion-loss copper twinax cables serve as a PCB alternative to enable efficient and reliable implementation of 56 and 112 Gbps PAM-4 protocols.
External Cables

Active Electrical Cables

  • Supporting next-gen data center design with speeds up to 112G PAM-4, Active Electrical Cables (AECs) extend the reach of copper cables up to 7.0m while reducing costs and ensuring excellent signal integrity and thermal management. Learn more about Molex AEC Solutions.

Direct Attach Cable (DAC) Assemblies

  • High-speed I/O passive cable assemblies that can deliver data rates as high as 400 Gbps with a variety of lengths or customized options for greater design flexibility.

Active Optical Cables (AOC)

  • Molex Active Optical Cables (AOCs) achieve high data rates over long reaches, using a fraction of the power of other brands while providing streamlined installation for high-performance computing and storage applications