Sockets

• Die/MCM attached to substrate using bumps in the traditional fashion
•  ASIC soldered to the motherboard in the traditional fashion (optional LGA socket attachment available)

Easier, smaller, cheaper PCB design

• Results in smaller motherboards
•  Requires fewer engineering hours for high-speed PCB design
•  Easier to route thehigh-speed signals from the die
•  Uses less space on the motherboard than nearASIC solutions
•  Delivers high-density twinax connections

Universal manufacturing automation

•  Needs only one machine type for multiple TGA applications
•  Speeds up time to market due to automated processes

Lower overall system cost

• Avoids optics in the rack
•  Eliminates re-timers, equalizers, amplifiers, etc.
•  Avoids the need for 112-Gbps PCB traces
•  Results in ultra-simple, low-cost motherboards

Create channels with the best signal integrity margin

• Offers cutting-edge performance
•  Capable of 112+ Gbps PAM-4 protocol

Enables new kinds of interconnect architectures

•  Entails a modular switch andrncompute cards (custom for thernworkload)
•  Enables a multiplicityrnof designs using onernmotherboard design
•  Allows for the creation ofrncompute node building blocksrnto configure at system level
•  Reduces engineering hoursrnspent to create a family ofrnswitch, compute, router,rnstorage products